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Chongqing Zhongshun Microelectronics Co., Ltd

Perceive Existence, Foresee the Future

Manufacturer from China
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1 Years
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SIP Packaging

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Camera Sensor Module

 [19]

ST Sensor

 [30]

MIPI Camera Module

 [32]

DVP Camera Module

 [7]

AHD Camera Module

 [1]

USB Camera Module

 [21]

Global Shutter Camera Module

 [7]

Raspberry Pi Camera Module

 [1]

OEM Camera Module

 [1]

Optical Lens

 [1]

Image Module

 [1]

Image Sensor Packaging

 [1]

MEMS Sensor

 [1]

SMT Testing

 [6]

SIP Packaging

 [6]
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Chongqing Zhongshun Microelectronics Co., Ltd
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City:chongqing
Province/State:chongqing
Country/Region:china
Contact Person:MrLu
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 SIP Packaging
China The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable for sale

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable 1. Technical Features: - Mature and stable process with ....
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China Stacked die SiP supports the integration of various types of dies such as memory and power dies for sale

Stacked die SiP supports the integration of various types of dies such as memory and power dies

Stacked die SiP supports the integration of various types of dies such as memory and power dies 1. Technical Features: - 3D Heterogeneous Integration ...
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China 3D SiP can customize differentiated 3D stacking architectures according to customer requirements for sale

3D SiP can customize differentiated 3D stacking architectures according to customer requirements

3D SiP can customize differentiated 3D stacking architectures according to customer requirements 1. Technical Features: - Ultra-high 3D heterogeneous ...
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China Customization System In Package For IoT / Automotive Electronics for sale

Customization System In Package For IoT / Automotive Electronics

System - in - package , applied in the Internet of Things , automotive electronics and other fields . - System-in-Package (SIP) is an advanced ...
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China SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP for sale

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP SiP (System‑in‑Package) is a core packaging technology ...
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China 2.5D SiP can integrate various bare dies to meet differentiated functional requirements for sale

2.5D SiP can integrate various bare dies to meet differentiated functional requirements

2.5D SiP can integrate various bare dies to meet differentiated functional requirements 1. Technical Features: - Outstanding high-density heterogeneou...
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